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A novel approach of chemical mechanical polishing for cadmium zinc telluride wafers
A novel approach of chemical mechanical polishing (CMP) is developed for cadmium zinc telluride (CdZnTe or CZT) wafers. The approach uses environment-friendly slurry that consists of mainly silica, hydrogen peroxide, and citric acid. This is different from the previously reported slurries that are u...
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| Publicado no: | Sci Rep |
|---|---|
| Main Authors: | , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group
2016
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4880934/ https://ncbi.nlm.nih.gov/pubmed/27225310 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/srep26891 |
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