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A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut
In this study, a novel approach of high speed scratching is carried out on silicon (Si) wafers at nanoscale depths of cut to investigate the fundamental mechanisms in wafering of solar cells. The scratching is conducted on a Si wafer of 150 mm diameter with an ultraprecision grinder at a speed of 8....
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| Publicado no: | Sci Rep |
|---|---|
| Main Authors: | , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group
2015
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4637873/ https://ncbi.nlm.nih.gov/pubmed/26548771 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/srep16395 |
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