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Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography
In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat mo...
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| Опубликовано в: : | Sensors (Basel) |
|---|---|
| Главные авторы: | , , , |
| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
MDPI
2015
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| Предметы: | |
| Online-ссылка: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4634459/ https://ncbi.nlm.nih.gov/pubmed/26473871 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s151025882 |
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