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Research on Defects Inspection of Solder Balls Based on Eddy Current Pulsed Thermography

In order to solve tiny defect detection for solder balls in high-density flip-chip, this paper proposed feasibility study on the effect of detectability as well as classification based on eddy current pulsed thermography (ECPT). Specifically, numerical analysis of 3D finite element inductive heat mo...

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Detalles Bibliográficos
Publicado en:Sensors (Basel)
Main Authors: Zhou, Xiuyun, Zhou, Jinlong, Tian, Guiyun, Wang, Yizhe
Formato: Artigo
Idioma:Inglês
Publicado: MDPI 2015
Assuntos:
Acceso en liña:https://ncbi.nlm.nih.gov/pmc/articles/PMC4634459/
https://ncbi.nlm.nih.gov/pubmed/26473871
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s151025882
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