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Elimination of strength degrading effects caused by surface microdefect: A prevention achieved by silicon nanotexturing to avoid catastrophic brittle fracture

The unavoidable occurrence of microdefects in silicon wafers increase the probability of catastrophic fracture of silicon-based devices, thus highlighting the need for a strengthening mechanism to minimize fractures resulting from defects. In this study, a novel mechanism for manufacturing silicon w...

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Publicat a:Sci Rep
Autors principals: Kashyap, Kunal, Kumar, Amarendra, Huang, Chuan-Torng, Lin, Yu-Yun, Hou, Max T., Andrew Yeh, J.
Format: Artigo
Idioma:Inglês
Publicat: Nature Publishing Group 2015
Matèries:
Accés en línia:https://ncbi.nlm.nih.gov/pmc/articles/PMC4455193/
https://ncbi.nlm.nih.gov/pubmed/26040924
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/srep10869
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