Caricamento...
Ductile film delamination from compliant substrates using hard overlayers
Flexible electronic devices call for copper and gold metal films to adhere well to polymer substrates. Measuring the interfacial adhesion of these material systems is often challenging, requiring the formulation of different techniques and models. Presented here is a strategy to induce well defined...
Salvato in:
| Pubblicato in: | Thin Solid Films |
|---|---|
| Autori principali: | , , |
| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Elsevier
2014
|
| Soggetti: | |
| Accesso online: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4307999/ https://ncbi.nlm.nih.gov/pubmed/25641995 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1016/j.tsf.2014.02.093 |
| Tags: |
Aggiungi Tag
Nessun Tag, puoi essere il primo ad aggiungerne! !
|