Učitavanje...
Ductile film delamination from compliant substrates using hard overlayers
Flexible electronic devices call for copper and gold metal films to adhere well to polymer substrates. Measuring the interfacial adhesion of these material systems is often challenging, requiring the formulation of different techniques and models. Presented here is a strategy to induce well defined...
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| Izdano u: | Thin Solid Films |
|---|---|
| Glavni autori: | , , |
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
Elsevier
2014
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| Teme: | |
| Online pristup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4307999/ https://ncbi.nlm.nih.gov/pubmed/25641995 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1016/j.tsf.2014.02.093 |
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