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Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such...
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| Hlavní autoři: | , , , , , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
Springer
2014
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| Témata: | |
| On-line přístup: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4197941/ https://ncbi.nlm.nih.gov/pubmed/25324705 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/1556-276X-9-541 |
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