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The Effect of Microstructure, Thickness Variation, and Crack on the Natural Frequency of Solar Silicon Wafers
Vibration is one of the most common loading modes during handling and transport of solar silicon wafers and has a great influence on the breakage rate. In order to control the breakage rate during handling and facilitate the optimization of the processing steps, it is important to understand the fac...
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| 主要な著者: | , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
American Society of Mechanical Engineers
2014
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| 主題: | |
| オンライン･アクセス: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3994764/ https://ncbi.nlm.nih.gov/pubmed/24891752 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1115/1.4024248 |
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