Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Lignende værker

• Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
  af: Chong Leong, Gan, et al.
  Udgivet: (2013)
• Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
  af: Gan, C. L., et al.
  Udgivet: (2013)
• Tensile behavior of Cu-coated Pd(40)Cu(30)Ni(10)P(20) metallic glassy wire
  af: Hussain, I., et al.
  Udgivet: (2018)
• Microelectronics and reliability.
  Udgivet: (1964-)
• Microelectronics interconnection and packaging /
  af: Electronics Magazine Books., et al.
  Udgivet: (c1980)