Resultados da pesquisa por Autor

1

Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Por Chong Leong, Gan, Uda, Hashim
Publicado em 2013

Obter o texto integral
Obter o texto integral
Obter o texto integral

Artigo

2

Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Por Chong Leong, Gan, Uda, Hashim
Publicado em 2014

Obter o texto integral
Obter o texto integral

Artigo