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High speed wafer scale bulge testing for the determination of thin film mechanical properties
A wafer scale bulge testing system has been constructed to study the mechanical properties of thin films and microstructures. The custom built test stage was coupled with a pressure regulation system and optical profilometer which gives high accuracy three-dimensional topographic images collected on...
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| Main Authors: | , , |
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| Format: | Artigo |
| Language: | Inglês |
| Published: |
American Institute of Physics
2010
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| Subjects: | |
| Online Access: | https://ncbi.nlm.nih.gov/pmc/articles/PMC2892528/ https://ncbi.nlm.nih.gov/pubmed/20515176 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1063/1.3427493 |
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