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High speed wafer scale bulge testing for the determination of thin film mechanical properties

A wafer scale bulge testing system has been constructed to study the mechanical properties of thin films and microstructures. The custom built test stage was coupled with a pressure regulation system and optical profilometer which gives high accuracy three-dimensional topographic images collected on...

Deskribapen osoa

Gorde:
Xehetasun bibliografikoak
Egile Nagusiak: Orthner, M. P., Rieth, L. W., Solzbacher, F.
Formatua: Artigo
Hizkuntza:Inglês
Argitaratua: American Institute of Physics 2010
Gaiak:
Sarrera elektronikoa:https://ncbi.nlm.nih.gov/pmc/articles/PMC2892528/
https://ncbi.nlm.nih.gov/pubmed/20515176
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1063/1.3427493
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