Differential Expression of Methicillin Resistance by Different Biofilm-Negative Staphylococcus epidermidis Transposon Mutant Classes

Biofilm formation mediated by polysaccharide intercellular adhesin (PIA) is the major virulence factor of Staphylococcus epidermidis and is often associated with methicillin resistance. Transposon Tn917 insertions leading to a biofilm-negative phenotype in the biofilm-producing S. epidermidis strain...

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Main Authors: Mack, Dietrich, Sabottke, Axel, Dobinsky, Sabine, Rohde, Holger, Horstkotte, Matthias A., Knobloch, Johannes K.-M.
Formato: Artigo
Idioma:Inglês
Publicado: American Society for Microbiology 2002
Assuntos:
Mechanisms of Resistance
Acceso en liña:https://ncbi.nlm.nih.gov/pmc/articles/PMC127015/
https://ncbi.nlm.nih.gov/pubmed/11751130
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1128/AAC.46.1.178-183.2002
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