Differential Expression of Methicillin Resistance by Different Biofilm-Negative Staphylococcus epidermidis Transposon Mutant Classes

Biofilm formation mediated by polysaccharide intercellular adhesin (PIA) is the major virulence factor of Staphylococcus epidermidis and is often associated with methicillin resistance. Transposon Tn917 insertions leading to a biofilm-negative phenotype in the biofilm-producing S. epidermidis strain...

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Détails bibliographiques
Auteurs principaux: Mack, Dietrich, Sabottke, Axel, Dobinsky, Sabine, Rohde, Holger, Horstkotte, Matthias A., Knobloch, Johannes K.-M.
Format: Artigo
Langue:Inglês
Publié: American Society for Microbiology 2002
Sujets:
Mechanisms of Resistance
Accès en ligne:https://ncbi.nlm.nih.gov/pmc/articles/PMC127015/
https://ncbi.nlm.nih.gov/pubmed/11751130
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1128/AAC.46.1.178-183.2002
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