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High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer
Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happ...
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| Main Authors: | , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
MDPI AG
2019-02-01
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| Series: | Micromachines |
| Assuntos: | |
| Acceso en liña: | https://www.mdpi.com/2072-666X/10/3/160 |
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