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High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer
Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happ...
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| 主要な著者: | , , , , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
MDPI AG
2019-02-01
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| シリーズ: | Micromachines |
| 主題: | |
| オンライン･アクセス: | https://www.mdpi.com/2072-666X/10/3/160 |
| タグ: |
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