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Research on the microwave interconnection technology of multifunctional components based on multi-layer PCB
In order to solve the difficulty of high density interconnection of multi-chip modules, a kind of microwave interconnection structure based on composite multi-layer printed circuit board(PCB) technology is designed.The optimized multi-layer interconnected structure is only 0.1 dB larger than the ins...
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| Autor principal: | |
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| Formato: | Artigo |
| Idioma: | Chinês |
| Publicado em: |
National Computer System Engineering Research Institute of China
2019-06-01
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| Colecção: | Dianzi Jishu Yingyong |
| Assuntos: | |
| Acesso em linha: | http://www.chinaaet.com/article/3000102893 |
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