Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original singl...

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Главные авторы: Di Zhao, Keke Zhang, Ning Ma, Shijie Li, Chenxiang Yin, Fupeng Huo
Формат: Artigo
Язык:Inglês
Опубликовано: MDPI AG 2020-02-01
Серии:Materials
Предметы:
sn2.5ag0.7cu0.1re/cu soldering
dynamic observation
isothermal aging
intermetallic compound
growth kinetics
fracture mechanism
Online-ссылка:https://www.mdpi.com/1996-1944/13/4/831
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