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Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original singl...

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Detalhes bibliográficos
Principais autores: Di Zhao, Keke Zhang, Ning Ma, Shijie Li, Chenxiang Yin, Fupeng Huo
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI AG 2020-02-01
coleção:Materials
Assuntos:
Acesso em linha:https://www.mdpi.com/1996-1944/13/4/831
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