Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original singl...

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Bibliografiset tiedot
Päätekijät: Di Zhao, Keke Zhang, Ning Ma, Shijie Li, Chenxiang Yin, Fupeng Huo
Aineistotyyppi: Artigo
Kieli:Inglês
Julkaistu: MDPI AG 2020-02-01
Sarja:Materials
Aiheet:
sn2.5ag0.7cu0.1re/cu soldering
dynamic observation
isothermal aging
intermetallic compound
growth kinetics
fracture mechanism
Linkit:https://www.mdpi.com/1996-1944/13/4/831
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