Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original singl...

詳細記述

保存先:
書誌詳細
主要な著者: Di Zhao, Keke Zhang, Ning Ma, Shijie Li, Chenxiang Yin, Fupeng Huo
フォーマット: Artigo
言語:Inglês
出版事項: MDPI AG 2020-02-01
シリーズ:Materials
主題:
sn2.5ag0.7cu0.1re/cu soldering
dynamic observation
isothermal aging
intermetallic compound
growth kinetics
fracture mechanism
オンライン･アクセス:https://www.mdpi.com/1996-1944/13/4/831
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