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Simulation on the Interfacial Singular Stress-strain Induced Cracking of Microelectronic Chip Under pPower On-off Cycles
Gorde:
| Egile nagusia: | |
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| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
MIDEM Society - Society for Microelectronics, Electronic Components and Materials
2019-09-01
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| Saila: | Informacije MIDEM |
| Gaiak: | |
| Sarrera elektronikoa: | http://www.midem-drustvo.si/Journal%20papers/MIDEM_49(2019)2p69.pdf |
| Etiketak: |
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