Lanean...
Performance of Cu–Ag Thin Films as Diffusion Barrier Layer
It is well-known that Cu–Sn intermetallic compounds are easily produced during reflow process and result in poor reliability of solder bump. Recently, amorphous metallic films have been considered to be the most effective barrier layer because of the absence of grain boundaries and immiscibility wit...
Gorde:
| Egile Nagusiak: | , |
|---|---|
| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
MDPI AG
2020-11-01
|
| Saila: | Coatings |
| Gaiak: | |
| Sarrera elektronikoa: | https://www.mdpi.com/2079-6412/10/11/1087 |
| Etiketak: |
Etiketa erantsi
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
|