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Enhancement of the Bond Strength and Reduction of Wafer Edge Voids in Hybrid Bonding
The hybrid wafer bonding technique is drawing much interest in relation to three-dimensional integration technology, and its areas of application are expanding from image sensors to semiconductor memory packages. In hybrid bonding, the bond strength and void formation are the main issues influencing...
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| 主要な著者: | , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
MDPI AG
2022-03-01
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| シリーズ: | Micromachines |
| 主題: | |
| オンライン･アクセス: | https://www.mdpi.com/2072-666X/13/4/537 |
| タグ: |
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