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Yield-improving test and routing circuits for a novel 3-D interconnect technology
This work presents a system to increase the yield of a novel 3-D chip integration technology. A built-in self-test and a routing system have been developed to identify and avoid faults on vertical connections between different stacked chips. The 3-D technology is based on stacking several active CMO...
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| Main Authors: | , , , , , , , , |
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| Formato: | Artigo |
| Idioma: | Alemão |
| Publicado em: |
Copernicus Publications
2006-01-01
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| Colecção: | Advances in Radio Science |
| Acesso em linha: | http://www.adv-radio-sci.net/4/225/2006/ars-4-225-2006.pdf |
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