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ELECTRODEPOSITION OF SOLDER BUMP TO SEMICONDUCTOR DEVICES
Using nonstationary regimes electrolysis for electrodepositing silver solder bump semiconductor blocked has reduced lateral expansion of different height on the plate, to improve the qualitative characteristics of the product, increase the number of devices produced on a semiconductor wafer, and the...
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| Main Authors: | , , , , , |
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| Formato: | Artigo |
| Idioma: | Russo |
| Publicado em: |
Educational institution «Belarusian State University of Informatics and Radioelectronics»
2019-06-01
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| Colecção: | Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki |
| Assuntos: | |
| Acesso em linha: | https://doklady.bsuir.by/jour/article/view/248 |
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