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Contribution of grain boundary to strength and electrical conductivity of annealed copper wires

The effect of grain boundaries on the strength and electrical conductivity of annealed copper wires was studied. After annealing at 100 °C for 30 min, the copper wires retained a fiber-like structure. The increase in electrical conductivity is believed to stem from the decrease of crystallographic d...

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Principais autores: Liming Dong, Fei Yang, Tianbo Yu, Ning Zhang, Xuefeng Zhou, Zonghan Xie, Feng Fang
פורמט: Artigo
שפה:Inglês
יצא לאור: Elsevier 2023-09-01
סדרה:Journal of Materials Research and Technology
נושאים:
Grain boundary
Annealing
Mechanical properties
Electrical conductivity
Recrystallization
גישה מקוונת:http://www.sciencedirect.com/science/article/pii/S2238785423018239
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