Preparation and optimization of capillary wick vapor chamber using copper paste based on capillary suspension
Absract To address the overheating issues in high-power integrated circuits, this article introduced a copper paste based on the capillary suspension which was printed on the vapor chamber. Research has shown that the addition of secondary fluid significantly changes the rheological properties of th...
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| Principais autores: | , , , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
SpringerOpen
2025-11-01
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| coleção: | Journal of Materials Science: Materials in Engineering |
| Assuntos: | |
| Acesso em linha: | https://doi.org/10.1186/s40712-025-00359-9 |
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