क्यूआर कोड

Preparation and optimization of capillary wick vapor chamber using copper paste based on capillary suspension

Absract To address the overheating issues in high-power integrated circuits, this article introduced a copper paste based on the capillary suspension which was printed on the vapor chamber. Research has shown that the addition of secondary fluid significantly changes the rheological properties of th...

पूर्ण विवरण

में बचाया:
ग्रंथसूची विवरण
मुख्य लेखकों: Zhiqian Yang, Kaixiang Hu, Rongsong Ge, Chaomin Chen, Tingting Jin, Guoqiang Ma, Yizhan Chen
स्वरूप: Artigo
भाषा:Inglês
प्रकाशित: SpringerOpen 2025-11-01
श्रृंखला:Journal of Materials Science: Materials in Engineering
विषय:
ऑनलाइन पहुंच:https://doi.org/10.1186/s40712-025-00359-9
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