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Relaxable Damage in Hot-Carrier Stressing of n-MOS Transistors

A method for device characterization is experimented to qualify the relaxable damage in hot-carrier stressing of n-MOS transistors. The degradation of physical parameters of the body-drain junction of power HEXFETs is presented for applied stress condition Vg= Vd/2. Large decrease of the resistance...

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Autori principali: M. Rahmoun, E. Bendada, A. El Hassani, K. Raïs
Natura: Artigo
Lingua:Inglês
Pubblicazione: Wiley 2000-01-01
Serie:Active and Passive Electronic Components
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Accesso online:http://dx.doi.org/10.1155/2000/74014
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