Ultrafast Laser Writing Deep inside Silicon with THz-Repetition-Rate Trains of Pulses
Three-dimensional laser writing inside silicon remains today inaccessible with the shortest infrared light pulses unless complex schemes are used to circumvent screening propagation nonlinearities. Here, we explore a new approach irradiating silicon with trains of femtosecond laser pulses at repetit...
I tiakina i:
| Ngā kaituhi matua: | , , |
|---|---|
| Hōputu: | Artigo |
| Reo: | Inglês |
| I whakaputaina: |
American Association for the Advancement of Science (AAAS)
2020-01-01
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| Rangatū: | Research |
| Urunga tuihono: | http://dx.doi.org/10.34133/2020/8149764 |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
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