Wafer-level perfect conformal contact lithography at the diffraction limit enabled by dry transferable photoresist

Lithography is a key enabling technique in modern micro/nano scale technology. Achieving the optimal trade-off between resolution, throughput, and cost remains a central focus in the ongoing development. However, current lithographic techniques such as direct-write, projection, and extreme ultraviol...

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Hlavní autoři:	Yu Zhou, Lei Chen, Zhiwen Shu, Fu Fan, Yueqiang Hu, Huigao Duan
Médium:	Artigo
Jazyk:	Inglês
Vydáno:	IOP Publishing 2025-01-01
Edice:	International Journal of Extreme Manufacturing
Témata:	perfect conformal contact lithography diffraction limit conformal pattern transfer large-aperture metalens
On-line přístup:	https://doi.org/10.1088/2631-7990/adf60f
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