Through glass via (TGV) copper metallization and its microstructure modification

The microstructure and uniformity of Cu metallization in the through glass via (TGV) structure were investigated through electron backscatter diffraction (EBSD) analysis system and finite element analysis (FEA) method. Two different direct current (DC) electroplating methods were employed for the TG...

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Главные авторы:	Yu-Hsun Chang, Yu-Ming Lin, Cheng-Yu Lee, Pei-Chia Hsu, Chih-Ming Chen, Cheng-En Ho
Формат:	Artigo
Язык:	Inglês
Опубликовано:	Elsevier 2024-07-01
Серии:	Journal of Materials Research and Technology
Предметы:	Through glass via (TGV) Finite element analysis (FEA) Electron backscatter diffraction (EBSD) Throwing power (TP) Electroplated Cu
Online-ссылка:	http://www.sciencedirect.com/science/article/pii/S2238785424014480
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