Through glass via (TGV) copper metallization and its microstructure modification

The microstructure and uniformity of Cu metallization in the through glass via (TGV) structure were investigated through electron backscatter diffraction (EBSD) analysis system and finite element analysis (FEA) method. Two different direct current (DC) electroplating methods were employed for the TG...

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التفاصيل البيبلوغرافية

المؤلفون الرئيسيون:	Yu-Hsun Chang, Yu-Ming Lin, Cheng-Yu Lee, Pei-Chia Hsu, Chih-Ming Chen, Cheng-En Ho
التنسيق:	Artigo
اللغة:	Inglês
منشور في:	Elsevier 2024-07-01
سلاسل:	Journal of Materials Research and Technology
الموضوعات:	Through glass via (TGV) Finite element analysis (FEA) Electron backscatter diffraction (EBSD) Throwing power (TP) Electroplated Cu
الوصول للمادة أونلاين:	http://www.sciencedirect.com/science/article/pii/S2238785424014480
الوسوم:	إضافة وسم لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!