Enhanced thermal conductivity and dielectric properties in electrostatic self-assembly 3D pBN@nCNTs fillers loaded in epoxy resin composites

High-performance epoxy (EP) composites with excellent thermal conductivity and dielectric properties have attracted increasing attention for effective thermal management. In this work, three-dimensional (3D) structural functional fillers were prepared by an electrostatic self-assembly approach. The...

Description complète

Détails bibliographiques

Auteurs principaux:	Dong-Li Zhang, Sheng-Nan Liu, Hui-Wu Cai, Qi-Kun Feng, Shao-Long Zhong, Jun-Wei Zha, Zhi-Min Dang
Format:	Artigo
Langue:	Inglês
Publié:	Elsevier 2020-12-01
Collection:	Journal of Materiomics
Sujets:	Thermal conductivity Dielectric permittivity Composites Electrostatic self-assembly
Accès en ligne:	http://www.sciencedirect.com/science/article/pii/S2352847820301969
Tags:	Ajouter un tag Pas de tags, Soyez le premier à ajouter un tag!