Effect of applied stress level on anisotropy in creep-aging behavior of Al–Cu–Li alloy

In the present work, the anisotropic creep aging (CA) behavior and microstructural evolution of Al–Cu–Li alloy are investigated under different stress levels. The results indicate that as the stress level increases, the anisotropic creep behavior of Al–Cu–Li alloy changes significantly. As the appli...

Descrizione completa

Dettagli Bibliografici

Autori principali:	Han Zhang, He Li, Wenfei Peng, Zhenru Jiang, Kai Ma, Longfei Lin, Yiyu Shao, Lihua Zhan
Natura:	Artigo
Lingua:	Inglês
Pubblicazione:	Elsevier 2023-11-01
Serie:	Journal of Materials Research and Technology
Soggetti:	Al-Cu-Li alloy Creep-aging anisotropy Microstructures Stress level Grain boundary slip
Accesso online:	http://www.sciencedirect.com/science/article/pii/S2238785423027503
Tags:	Aggiungi Tag Nessun Tag, puoi essere il primo ad aggiungerne!!