Effect of applied stress level on anisotropy in creep-aging behavior of Al–Cu–Li alloy

In the present work, the anisotropic creep aging (CA) behavior and microstructural evolution of Al–Cu–Li alloy are investigated under different stress levels. The results indicate that as the stress level increases, the anisotropic creep behavior of Al–Cu–Li alloy changes significantly. As the appli...

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Detalhes bibliográficos

Principais autores:	Han Zhang, He Li, Wenfei Peng, Zhenru Jiang, Kai Ma, Longfei Lin, Yiyu Shao, Lihua Zhan
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Elsevier 2023-11-01
coleção:	Journal of Materials Research and Technology
Assuntos:	Al-Cu-Li alloy Creep-aging anisotropy Microstructures Stress level Grain boundary slip
Acesso em linha:	http://www.sciencedirect.com/science/article/pii/S2238785423027503
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