An improved semiconductor thin film thickness measurement method based on full-spectrum fitting technology
With the advancement of semiconductor technology, thin films play an irreplaceable role in communications and integrated circuits as their thickness and optical parameters critically impact the performance of integrated circuits, displays, optoelectronic devices, and solar cells. Currently, full-spe...
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| 主要な著者: | , , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
AIP Publishing LLC
2025-11-01
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| シリーズ: | AIP Advances |
| オンライン･アクセス: | https://pubs.aip.org/aip/adv/article-pdf/doi/10.1063/5.0283487/20796413/115313_1_5.0283487.pdf |
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