An improved semiconductor thin film thickness measurement method based on full-spectrum fitting technology
With the advancement of semiconductor technology, thin films play an irreplaceable role in communications and integrated circuits as their thickness and optical parameters critically impact the performance of integrated circuits, displays, optoelectronic devices, and solar cells. Currently, full-spe...
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| Автори: | , , |
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| Формат: | Artigo |
| Мова: | Inglês |
| Опубліковано: |
AIP Publishing LLC
2025-11-01
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| Серія: | AIP Advances |
| Онлайн доступ: | https://pubs.aip.org/aip/adv/article-pdf/doi/10.1063/5.0283487/20796413/115313_1_5.0283487.pdf |
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