Fabrication of High-Performance Insulated Metal Substrates Employing h-BN Mixture/Epoxy Composite Coated on Roughened Copper Plate
In this work, an Insulated Metal Substrate (IMS) for packaging high-power electronic devices was created using hexagonal Boron Nitride (h-BN) mixture-based Thermally Conductive Adhesive (TCA) and copper plate with a matte side. Mechanical exfoliation of micron-scale BN particles results in a BN mixt...
Tallennettuna:
| Päätekijät: | , , , , |
|---|---|
| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
Kaunas University of Technology
2024-05-01
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| Sarja: | Medžiagotyra |
| Aiheet: | |
| Linkit: | https://matsc.ktu.lt/index.php/MatSc/article/view/34711 |
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