The effect of bi presence as impurities in anodic copper on kinetics and mechanism of anodic dissolution and cathodic deposition of copper
The influence of Bi, as foreign metal atoms in anode copper, on kinetics and mechanism of anodic dissolution and cathodic deposition of copper in acidic sulfate solution was investigated using the galvanostatic single-pulse method. Results indicate that presence of Bi atoms in anode copper increases...
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| Autors principals: | , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Association of Chemical Engineers of Serbia
2010-01-01
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| Col·lecció: | Hemijska Industrija |
| Matèries: | |
| Accés en línia: | http://www.doiserbia.nb.rs/img/doi/0367-598X/2010/0367-598X1000021S.pdf |
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