Effect of Copper Ion and Water on Anodic Dissolution of Metallic Copper in a Deep Eutectic Solvent (DES)

This report presents influence of water and copper salt on the anodic dissolution of metallic copper in a eutectic solvent of choline chloride and ethylene glycol (DES) in a 1 : 2 molar ratio. The mechanism of copper dissolution anodically was investigated using anodic linear sweep voltammetry (LSV)...

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Auteurs principaux:	Wrya O. KARIM, Jamil A. JUMA, Khalid M. OMER, Kosar Hikmat HAMA AZIZ, Yousif M. SALAH, Shujahadeen B. AZIZ
Format:	Artigo
Langue:	Inglês
Publié:	The Electrochemical Society of Japan 2021-01-01
Collection:	Electrochemistry
Sujets:	anodic dissolution anodic linear sweep study deep eutectic solvent impedance
Accès en ligne:	https://www.jstage.jst.go.jp/article/electrochemistry/89/1/89_20-00129/_pdf/-char/en
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