Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy
The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with negligible loss of the plasticity. Especially, th...
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| Autors principals: | , , , , , , , , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
Elsevier
2023-09-01
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| Col·lecció: | Journal of Materials Research and Technology |
| Matèries: | |
| Accés en línia: | http://www.sciencedirect.com/science/article/pii/S2238785423021233 |
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