Van der Waals integration of 2D materials for advanced intelligent computing
The increasing demand for faster, energy-efficient, and higher bandwidth semiconductor devices has pushed conventional Si-based scaling to its fundamental limits, including mobility degradation, short-channel effects, and high power consumption. To overcome these challenges, three-dimensional integr...
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| Principais autores: | , , , , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
IOP Publishing
2025-01-01
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| Colecção: | Neuromorphic Computing and Engineering |
| Assuntos: | |
| Acesso em linha: | https://doi.org/10.1088/2634-4386/ae294e |
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