Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor
Integrated circuits have several applications, including medicine and the aerospace industry, where reliability is essential. Packaging is an important step in the manufacturing of integrated circuits, and ball soldering is one of the most critical process, especially in assembling and interconnecti...
Tallennettuna:
| Päätekijät: | , , , , , |
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| Aineistotyyppi: | Artigo |
| Kieli: | Inglês |
| Julkaistu: |
Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol)
2018-02-01
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| Sarja: | Materials Research |
| Aiheet: | |
| Linkit: | http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392017000800858&tlng=en |
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