Validation of Experimental Cooling Performance of Multi-Stage Thin-Film Thermoelectric Devices via Numerical Simulation

In-plane thermoelectric thin-film cooling devices are considered a promising solution for thermal management in electronic systems. However, the actual cooling performance is far below that of regular bulk cooling devices, making the design of thin-film devices much more difficult. In this work, a n...

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Autores principales:	Yu Ning, Longzhou Li, Ping Wei, Shaoqiu Ke, Wanting Zhu, Xiaolei Nie, Danqi He, Mingrui Liu, Wenyu Zhao
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	MDPI AG 2025-05-01
Colección:	Micromachines
Materias:	thermoelectric coolers thin-film device finite element simulation cooling temperature difference
Acceso en línea:	https://www.mdpi.com/2072-666X/16/6/648
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