The on-chip thermoelectric cooler: advances, applications and challenges
With the development of 5G technology and increasing chip integration, traditional active cooling methods struggle to meet the growing thermal demands of chips. Thermoelectric coolers (TECs) have garnered great attention due to their rapid response, significant cooling differentials, strong compatib...
Zapisane w:
| Główni autorzy: | , , , , , , , , , |
|---|---|
| Format: | Artigo |
| Język: | Inglês |
| Wydane: |
Elsevier
2024-06-01
|
| Seria: | Chip |
| Hasła przedmiotowe: | |
| Dostęp online: | http://www.sciencedirect.com/science/article/pii/S2709472324000145 |
| Etykiety: |
Nie ma etykietki, Dołącz pierwszą etykiete!
|