Enhanced cross-interfacial growth by thickening transition layers and tailoring grain size of columnar nanotwinned Cu films
Electrodeposited <111>-oriented nanotwinned Cu (NT-Cu) films consist of micron-scale columnar grains and they are thermally stable up to 400 °C. By adding nanoscale equiaxed Cu grains at the bottom of the NT-Cu films, anisotropic large grain growth could be triggered below 200 °C. The grains grew ov...
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| Glavni autori: | , , , |
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| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
Elsevier
2024-11-01
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| Serija: | Journal of Materials Research and Technology |
| Teme: | |
| Online pristup: | http://www.sciencedirect.com/science/article/pii/S2238785424022440 |
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