Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste
A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesis of the plate-type Cu formate particles from CuO was a...
Wedi'i Gadw mewn:
| Prif Awduron: | , |
|---|---|
| Fformat: | Artigo |
| Iaith: | Inglês |
| Cyhoeddwyd: |
Polish Academy of Sciences
2020-07-01
|
| Cyfres: | Archives of Metallurgy and Materials |
| Pynciau: | |
| Mynediad Ar-lein: | https://journals.pan.pl/Content/116382/PDF/AMM-2020-3-15-Jong-Hyun%20Lee.pdf |
| Tagiau: |
Dim Tagiau, Byddwch y cyntaf i dagio'r cofnod hwn!
|