Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste
A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesis of the plate-type Cu formate particles from CuO was a...
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| Principais autores: | , |
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| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Polish Academy of Sciences
2020-07-01
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| Colecção: | Archives of Metallurgy and Materials |
| Assuntos: | |
| Acesso em linha: | https://journals.pan.pl/Content/116382/PDF/AMM-2020-3-15-Jong-Hyun%20Lee.pdf |
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