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Experimental and numerical investigations of full-field strain measurement and fracture parameter of lead-free solder using DIC technique
In this study, rupture of notched SENT specimens fabricated from a novel lead-free solder alloy is investigated. The lead-free solder alloy, focused on in this study, is particularly used as interconnect material in power modules of electric vehicles. Its commercial denomination is InnoLot and it c...
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| Hauptverfasser: | , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
Publishing House for Science and Technology
2020-03-01
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| Schriftenreihe: | Vietnam Journal of Mechanics |
| Schlagworte: | |
| Online Zugang: | https://vjs.ac.vn/index.php/vjmech/article/view/14397 |
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