Mold Fabrication for 3D Dual Damascene Imprinting
<p>Abstract</p> <p>Previously, a damascene process based on nanoimprint lithography has been proposed (Schmid G M, et al. in J Vac Sci Technol B 24(3) 1283, 2006) to greatly reduce the fabrication steps of metal interconnection in integrated circuit. For such a process to become a viable technique,...
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| Hlavní autoři: | , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
SpringerOpen
2010-01-01
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| Edice: | Nanoscale Research Letters |
| Témata: | |
| On-line přístup: | http://dx.doi.org/10.1007/s11671-010-9540-2 |
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